Palladium Plating Services
For your Palladium Plating requirements, ProPlate® has facilities for palladium electroplating both small and large parts in various sized barrels and racks, along with custom and prototype metal finishing.
Palladium, is a soft and rare metal, known for its silvery-blue yet lustrous appearance. It also has a low melting point and low density and like gold, does not oxidize at room temperature. As such it is well suited to plating applications where the prevention of an oxide formation is required. However, it can also act as a substitute for gold plating, providing a functional alternative at a much lower price.
MIL-P-45209, ASTM B679
The melting point of palladium is 2,830 degrees Fahrenheit. Palladium plating has been used for plating over ceramic insulators in various types of connector applications.
The koop hardness of palladium can be as high as 400 as compared with cobalt hardened Type 2 gold which has a maximum knoop hardness of 200. For electrical contact applications where there are point contact or sliding contact concerns, the use of palladium plating services is the ideal choice. Rhodium should be considered for extremely high wear conditions.
Gold is more expensive per troy ounce than palladium. A cost comparison between the two can be found at our current metal price charts. Although palladium is more of a white metal and different in color than yellow gold, it is an excellent substitute for gold in most general electronics applications.
Anti-diffusion & Multi-layer Plating
Palladium plating should be considered in a multi-plating process. When metallic copper is used as the outer layer in electroplating over gold plating, it can diffuse through the gold electrodeposit and begin to partially oxide on the surface of the electrodeposited part. However, if a layer of nickel or palladium is used between the copper and the gold, the copper will not diffuse through this intermediate layer.
Nickel is lower in cost than palladium and so is generally suggested for use for anti-diffusion. However, whereas nickel is a metallic metal and palladium is not, the latter is used as the anti-duffusion layer where non-magnetic performance is required. It can also replace gold in other non-magnetic, non-oxidizing applications.
As palladium has very good solderability characteristics, the standard soldering procedures that are used for gold can also be used for soldering palladium.